Terafab's strategy bypasses ASML EUV lithography backlogs through extreme physical chip scale and custom designs not constrained by mobile/server thermal envelopes.

Verification notes

Reported by notateslaapp.com and others as Terafab's working strategy. The technical premise — that wafer-scale or large-die designs reduce per-bit EUV demand — is contested; ASML capacity remains a real constraint regardless of die size.

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1. Unverified 2w ago

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